Sapphire Radeon RX 7900 XTX Nitro+ Vapor-X 24GB GDDR6 PCI-Express Graphics Card
The Vapor Chamber is mounted in contact with the surface of the main chip and memory. Since the entire area transfers heat at the same rate, the Vapor-X module has been engineered to operate more efficiently than a copper heat sink at carrying away heat. Upon gaining heat, the heat source is pushed to the Vaporization Wicks to begin the heat dissipation process. Due to extreme low pressure, working fluid and pure water are easily vaporized, and transferred through the vacuum until reaching the Condensing Wick which is adjacent to the cooled surface. From here, it turns back to a liquid state whereby the liquid is then absorbed into the Transportation Wick by capillary action and moved back towards the Vaporization Wick. A recycled liquid system occurs when the heat source reheats the liquid and it becomes re-vaporized by the Vaporization Wick to restart the Vapor-X Cooling process.
WAVE Fin Design &
V-Shape Fin Design for GPU cooling
The WAVE Fin Design reduces friction when the wind goes into the fin module resulting in a reduction of the wind cut noise.
The V-shape fin design on top of the GPU accelerates and centralizes the air flow around the GPU to dissipate heat efficiently.
Die Casted Aluminum-Magnesium
Alloy Frame & Frontplate Heatsink
The Die Casted Aluminum-Magnesium Alloy Frame enveloping the sides of the PCB help to strengthen the structural stiffness of the shroud to create a strong, scratch resistant and high quality finish that elevates the aesthetic and strength of the graphics card. Overlaying the entire PCB, the die casted Frontplate Heatsink cools the VRM, Memory and Chokes resulting in superior heat dissipation for top-notch airflow and cooling performance.
SAPPHIRE NITRO+ & PULSE AMD Radeon™ RX 7900 Series are designed with digital power which provides accurate power control and excellent power efficiency
Ultra High Performance Conductive
Polymer Aluminum Capacitor
The Ultra High Performance Conductive Polymer Aluminum Capacitor has a small PCB foot print but high volumetric capacitance that makes 20-phase power possible on the RX 7900 series graphics card. The capacitor offers stable capacitance at a high frequency and temperature with very low signal noise, ensuring the stability and reliability of the product.
TG Copper PCB
The GPU is mounted on to the high-density 14 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.
Dedicated VRM cooling module to create optimal heat dissipation for peak airflow and cooling performance.
The Angular Velocity Fan Blade provides a double layer of downward air pressure which alongside the air pressure on the outer ring of the Axial fan, results in up to 44% more downward air pressure and up to 19% more airflow for a quieter and cooler operation when compared to the previous generations.
AMD RDNA™ 3 Architecture
NITRO+ AMD Radeon™ RX 7900 XTX Vapor-X 24GB
$1,357.00 – $1,640.00
✓ GPU: Boost Clock: Up to 2680 MHz
✓ GPU: Game Clock: Up to 2510 MHz
✓ Memory: 24GB/384 bit DDR6. 20 Gbps Effective
✓ Stream Processors: 6144
✓ RDNA™ 3 Architecture
✓ Ray Accelerator: 96
|AMD Radeon™ RX 7900 XTX Graphics Card
AMD RDNA™ 3 Architecture
|Boost Clock: Up to 2680 MHz
Game Clock: Up to 2510 MHzBoost Clock is the maximum frequency achievable on the GPU running bursty workload. Boost clock achievability, frequency, and sustainabilty will vary based on several factors, including but not limited to: thermal conditions and variation in application and workloads.
Game Clock is the expected GPU clock when running typical gaming applications, set to typical TGP(Total Graphics Power). Actual individual game clock results may vary.
|96 CU (with RT+AI Accelerators)
|24GB/384 bit GDDR6
|20 Gbps Effective
|Maximum 4 Displays
DisplayPort 2.1: 7680×4320
|PCI-Express 4.0 x16
|3.5 slot, ATX
Dimension: 320(L)X 135.75(W)X 71.6 (H)mm
|420W Total Board Power
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