NITRO+ AMD Radeon™ RX 7900 XTX Vapor-X 24GB

$1,357.00 – $1,640.00

✓ GPU: Boost Clock: Up to 2680 MHz
✓ GPU: Game Clock: Up to 2510 MHz
✓ Memory: 24GB/384 bit DDR6. 20 Gbps Effective
✓ Stream Processors: 6144
✓ RDNA™ 3 Architecture
✓ Ray Accelerator: 96

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  • Sapphire Radeon RX 7900 XTX Nitro+ Vapor-X 24GB GDDR6 PCI-Express Graphics Card

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    Vapor-X

    Cooling

    The Vapor Chamber is mounted in contact with the surface of the main chip and memory. Since the entire area transfers heat at the same rate, the Vapor-X module has been engineered to operate more efficiently than a copper heat sink at carrying away heat. Upon gaining heat, the heat source is pushed to the Vaporization Wicks to begin the heat dissipation process. Due to extreme low pressure, working fluid and pure water are easily vaporized, and transferred through the vacuum until reaching the Condensing Wick which is adjacent to the cooled surface. From here, it turns back to a liquid state whereby the liquid is then absorbed into the Transportation Wick by capillary action and moved back towards the Vaporization Wick. A recycled liquid system occurs when the heat source reheats the liquid and it becomes re-vaporized by the Vaporization Wick to restart the Vapor-X Cooling process.

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    WAVE Fin Design &

    V-Shape Fin Design for GPU cooling

    The WAVE Fin Design reduces friction when the wind goes into the fin module resulting in a reduction of the wind cut noise.
    The V-shape fin design on top of the GPU accelerates and centralizes the air flow around the GPU to dissipate heat efficiently.

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    Die Casted Aluminum-Magnesium

    Alloy Frame & Frontplate Heatsink

    The Die Casted Aluminum-Magnesium Alloy Frame enveloping the sides of the PCB help to strengthen the structural stiffness of the shroud to create a strong, scratch resistant and high quality finish that elevates the aesthetic and strength of the graphics card. Overlaying the entire PCB, the die casted Frontplate Heatsink cools the VRM, Memory and Chokes resulting in superior heat dissipation for top-notch airflow and cooling performance.

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    Digital

    Power Design

    SAPPHIRE NITRO+ & PULSE AMD Radeon™ RX 7900 Series are designed with digital power which provides accurate power control and excellent power efficiency

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    Ultra High Performance Conductive

    Polymer Aluminum Capacitor

    The Ultra High Performance Conductive Polymer Aluminum Capacitor has a small PCB foot print but high volumetric capacitance that makes 20-phase power possible on the RX 7900 series graphics card. The capacitor offers stable capacitance at a high frequency and temperature with very low signal noise, ensuring the stability and reliability of the product.

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    High

    TG Copper PCB

    The GPU is mounted on to the high-density 14 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.

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    Dedicated

    VRM Cooling

    Dedicated VRM cooling module to create optimal heat dissipation for peak airflow and cooling performance.

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    Angular Velocity

    Fan Blade

    The Angular Velocity Fan Blade provides a double layer of downward air pressure which alongside the air pressure on the outer ring of the Axial fan, results in up to 44% more downward air pressure and up to 19% more airflow for a quieter and cooler operation when compared to the previous generations.

  • AMD RDNA™ 3 Architecture

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GPU AMD Radeon™ RX 7900 XTX Graphics Card
5nm GPU
AMD RDNA™ 3 Architecture
Engine Clock Boost Clock: Up to 2680 MHz
Game Clock: Up to 2510 MHzBoost Clock is the maximum frequency achievable on the GPU running bursty workload. Boost clock achievability, frequency, and sustainabilty will vary based on several factors, including but not limited to: thermal conditions and variation in application and workloads.

Game Clock is the expected GPU clock when running typical gaming applications, set to typical TGP(Total Graphics Power). Actual individual game clock results may vary.
Stream Processors 6144
Compute Units 96 CU (with RT+AI Accelerators)
Infinity Cache 96MB
Ray Accelerators 96
Memory Size/Bus 24GB/384 bit GDDR6
Memory Clock 20 Gbps Effective
Displays Maximum 4 Displays
Resolution HDMI™: 7680×4320
DisplayPort 2.1: 7680×4320
Interface PCI-Express 4.0 x16
Output 2x HDMI
2x DisplayPort
Cooling 3 Fans
Vapor-X Cooling
Form Factor 3.5 slot, ATX
Dimension: 320(L)X 135.75(W)X 71.6 (H)mm
Power Consumption 420W Total Board Power

 

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