THE WORLD'S FIRST MEMORY-COMPUTING INTEGRATED HIGH-THROUGHPUT PROCESSOR

DEVELOPMENT FROM THE CORE UP

In the past few decades, research progress has been slow. In order to solve this problem, JASMINER researchers overcame layers of technical blockade and developed a high-throughput computing power chip that integrates storage and computing in 2020, and entered the market in 2021.

The chip adopts 3DIC technology, by integrating the data storage unit and the computing unit on the same chip, thereby greatly improving the parallelism and energy efficiency of computing. Its die area is super large size 678 mm², package size 45mm×45mm, memory access bandwidth 1TByte/s, storage capacity 5GByte/s, processing capacity up to 65MH/s, and power consumption is only 23W. The high-throughput computing power chip based on the on-chip ultra-large-scale fully-associated network can achieve the performance balance between the computing core and the data path, so that the computing efficiency can be fully utilized.

Under the vision of “carbon neutral”, low-carbon development is not only a commitment of JASMINER, but also a common mission of all walks of life. Benefiting from the two major highlights of path advantages and technological innovation, JASMINER X4 has achieved the ultimate in power consumption and continues to lead the industry. The emergence of the new generation of high-throughput computing power chip JASMINER X4 provides a typical model for the global chip industry to achieve the “carbon peak” and “carbon neutral” strategy, and also painted a blueprint for technological development for JASMINER to promote the green transformation of global basic computing power facilities.