Intel® Z690 (LGA 1700) ATX gaming motherboard, 15 DrMOS power stages, PCIe® 5.0, DDR4 memory, four M.2 slots, WiFi 6 and Intel 2.5 Gb Ethernet,

HDMI®, DisplayPort™, USB 3.2 Gen 2x2 Type-C®, front USB 3.2 Gen 2 Type C, SATA 6 Gbps, Thunderbolt™ 4 header and Aura Sync RGB lighting

✔ Intel® LGA 1700 socket: Ready for 12th Gen Intel Core™ processors
Enhanced power solution: 14+1 DrMOS, six-layer PCB, ProCool sockets, alloy chokes and durable capacitors for stable power delivery
✔ Next-gen connectivity: PCIe® 5.0, USB 3.2 Gen2x2 Type-C®, front USB 3.2 Gen 2 Type-C, Thunderbolt™ 4 header support
✔ Made for online gaming: WiFi 6, Intel 2.5 Gb Ethernet and TUF LANGuard
✔ Two-way AI Noise-Cancelation: Reduces background noise from the microphone and audio output for crystal-clear communication in games or video conferences
✔ Comprehensive cooling: Enlarged VRM heatsink, PCH fanless heatsink, M.2 heatsinks, hybrid fan headers and Fan Xpert 4 utility in Armoury Crate
✔ Outshine RGB Aura Effect: Stylish edge and PCH lighting design, addressable RGB headers and RGB strip header support

DrMOS

The onboard VRMs feature 14+1 DrMOS power stages that combine high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that 12th Gen Intel Core processors demand.The power stages are each rated to handle 80 amperes to provide stable performance for current and future Intel processors

Cooler by

design

1. Enlarged VRM heatsink: The extensive surface area of the massive heatsink covers the VRMs and chokes to improve heat dissipation.
2. Enlarged PCH heatsink An expanded surface area for the chipset cooler maximizes performance and heat dissipation.
3. Three M.2 slots with heatsinks Three out of four M.2 slots have dedicated heatsinks, keeping M.2 SSDs at optimal operating temperatures to ensure consistent performance and reliability.

DRAM Overclocking

Performance

Improvements to trace routing design provide the latest Intel processors with enhanced access to memory bandwidth. ASUS OptiMem II technology carefully maps memory signal pathways across different PCB layers to reduce path distance, and it adds shielding zones that significantly reduce crosstalk.